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Hiper To Demo OSIRIS Case @ CeBIT
Hiper To Demo OSIRIS Case @ CeBIT
Written by Visionary and filed under News > Cooling & Chassis
Published on February 28, 2008, 11:49 am
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Osiris is constructed for toolless assembly with an innovative airflow concept as the ultimate cooling solution: The PSU is located at the bottom with a direct fresh air intake, so the heat of the PSU is isolated from the case completely. On the top and on the back there are 120mm fans with 3pin plugs for connecting with the motherboard. The edges of the buttons, plugs and the front side are diamond laser cut. The case will be available in brushed black and brushed silver finish. Osiris is entirely made of 6063-T5 military spec alloy, which offers outstanding heat dissipation. Read More >>